About: http://webisa.webdatacommons.org/94523610

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The purpose of the die or chip packaging process is to place individual die into a package which can then be inserted into a printed circuit board or other substrate so as to connect the die to a larger functional circuit.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com