About: http://webisa.webdatacommons.org/94726183

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The two die 723 and 727 may both be attached to the common die pad 725 using a conductive attach layer such as solder or silver-filled epoxy in which case the substrate of both die will share the same electrical potential.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com