| http://www.w3.org/ns/prov#value | - The structure shown in FIG. 2E is then subjected to a planarization process such as CMP, to produce the planarized structure shown in FIG. 2F. The liner conductor 18 is then subjected to a recess etch to form the recessed regions indicated at E. In one embodiment, the recess etch may be a short wet etch.
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