About: http://webisa.webdatacommons.org/95155824

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Third insulating layer 38 then may be subjected to a planarization process, such as by CMP, ECMP, etching, sputtering, or the like, to facilitate formation of a substantially planar surface 54 of third insulating layer 38.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com