| http://www.w3.org/ns/prov#value | - That is, a semiconductor device, such as semiconductor device of the plurality of semiconductor devices 1078 and more specifically the semiconductor device 1130 shown in phantom on the block 1110 is urged upwardly to be in contact with the curable adhesive 1132 that has been positioned on each lead frame of the plurality of substrates 1012 by the application means 1032.
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