About: http://webisa.webdatacommons.org/98948145

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates generally to semiconductor device packages including leads that are electrically exposed through the packages and to methods for fabricating such semiconductor device packages.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com.au