Head noun: packagingPostmodifier: of microelectronic device
| Same concepts |
|---|
Broader concepts
| label | provenance | confidence |
|---|
Narrower concepts
| label | provenance | confidence |
|---|---|---|
| assembly of integrate semiconductor | isap:185424074 | 0.557738 |
| contact bonding | isap:318204064 | 0.509630 |