About: molding compound

Premodifier: molding
Head noun: compound

Same concepts

Broader concepts

label	provenance	confidence
semiconductor device package	isap:341244202	0.788240
organic material	isap:57689208	0.631479
material	isap:57689142	0.536990
encapsulant	isap:83155250	0.513741
mold	isap:382126042	0.349587

Narrower concepts

label	provenance	confidence
epoxy resin	isap:291682089	0.479970
fiber	isap:295032939	0.342390
resin	isap:291682109	0.292371