Premodifier: solderHead noun: bump
| Same concepts |
|---|
Broader concepts
| label | provenance | confidence |
|---|---|---|
| solder bump | isap:178515712 | 0.764617 |
| metal bump | isap:178515710 | 0.749253 |
| bump | isap:178515707 | 0.748199 |
| external connection terminal | isap:458706437 | 0.708842 |
| connection terminal | isap:458706438 | 0.698217 |
| conductive material | isap:456048656 | 0.692040 |
| bonding material | isap:456048655 | 0.690203 |
| conductive structure | isap:287449788 | 0.676542 |
| plurality of conductive bump | isap:287571140 | 0.631159 |
| interconnection | isap:515825804 | 0.522132 |
| structure | isap:287449789 | 0.522039 |
| present invention | isap:286243474 | 0.514386 |
| interconnect | isap:314368633 | 0.504465 |
| connection | isap:189188156 | 0.497672 |
| means | isap:94232900 | 0.472951 |
| die | isap:126758719 | 0.428385 |
| device | isap:304107349 | 0.427056 |
| technology | isap:189989394 | 0.385345 |
Narrower concepts
| label | provenance | confidence |
|---|---|---|
| solder bump | isap:178515712 | 0.764617 |
| bump | isap:178515731 | 0.300357 |
| connection | isap:506336066 | 0.224420 |