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An Entity of Type : prov:Entity, within Data Space : wifo5-40.informatik.uni-mannheim.de:8890 associated with source dataset(s)

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  • a substrate having a plurality of contact pads on a first surface electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate, the first surface of the substrate including a centrally located portion capable of mounting an integrated circuit (IC) die;
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is prov:wasDerivedFrom of
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