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An Entity of Type : prov:Entity, within Data Space : wifo5-40.informatik.uni-mannheim.de:8890 associated with source dataset(s)

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  • In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices.
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