prov:value
| - A plurality of contact pads 304 (compare 104, 204, 254) are disposed on the top surface 302 a of the substrate 302, and are covered by a thin layer 306 (compare 206, 256) of insulating material, such as a polymer, (or, in the case of the substrate 302 being a semiconductor wafer, a passivation layer) which has openings 308 (compare 108, 208, 258) aligned with (centered over) the pads 304.
|