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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • A semiconductor chip package wherein the chip is a major contributor to the strength of the encapsulation structure, the external contacts to the package and the chip wiring are provided through a multilayer wiring member wherein broad metal areas are of mesh configuration and the electrical transmission properties of the package employ at least portions of one of the multilayer wiring member laye
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