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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • ds and the chip package may be encapsulated (e.g. in epoxy), isolating them from the protosubstrate environment; (4) chip packages are available that are inert when contacted with aggressive chemicals or compatible with a use in high vacuum systems; (5) the protosubstrate mounted on a chip package may be enclosed e.g. using a commercially available lid or cover.
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