| http://www.w3.org/ns/prov#value | - As already mentioned, an embodiment of the invention relates particularly to a process for packaging micro-components 1, and particularly electromechanical micro-systems, previously made with a plurality of micro-systems on the same wafer or substrate disk 2, for example made of a semiconducting material such as silicon or a composite material such as glass covered with a polysilicon layer.
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