About: http://webisa.webdatacommons.org/140393808

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	An advantage of the present invention is a method of manufacturing a semiconductor device having highly reliable Cu and Cu alloy interconnect members.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es