About: http://webisa.webdatacommons.org/216840679

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is an improved method for manufacturing electronic devices of the type having a flexible substrate, a layer of semiconductor material on the substrate, and an encapsulant layer over the semiconductor material.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com