| http://www.w3.org/ns/prov#value | - In the process step illustrated in FIG. 17, a silicon layer 170 (e.g. a previously processed and tested silicon wafer) having a thickness ranging from about 100 ??m to about 300 ??m, such as about 200 ??m, is adhesively attached to the circuit board 102 (i.e., an organic board).
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