| http://www.w3.org/ns/prov#value | - When an insulator layer is deposed on a fully processed wafer and contact openings are formed on the metal pads followed by a metal deposition with thickness 100 ??? more than the depth of the contact windows, the metal pads now are extended above oxide layer only 100 ???, the pads can be separated each other by a very small distance, e.g. 20 ??m.
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