| http://www.w3.org/ns/prov#value | - Accordingly, it is not necessary to coat the cover lay film or the resist ink, that have been necessary conventionally, in order to prevent a solder bridge, and mounting can be made with the minimum pitch of the circuit pattern of the conductor 2 that can be formed by printing, e.g. 300 ??m, as the pitch of mounting the components.
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