| http://www.w3.org/ns/prov#value | - Next, as shown in FIG. 6, an insulating material such as TEOS or BPSG is deposited, whereby the trenches 111 and the openings formed in the laminated structure consisting of the gate oxide film 105, the polycrystalline silicon film 106, and the nitride film 201 are filled up with burying or burying members 112.
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