| http://www.w3.org/ns/prov#value | - temperature, the first temperature being within the range of 70-190 degrees Celsius; affixing the second surface of the chip to a head of the thermo-compression bonder, the head including a heater, the head being maintained at a second temperature, the second temperature being less than 120 degrees Celsius; generally aligning the solder bumps with corresponding metal protrusions; lowering the hea
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