About: http://webisa.webdatacommons.org/166848089

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The CMP planarization process has drawbacks such as the high costs in running the process and the difficulty in achieving uniformity in the thickness of the polished surface of the semiconductor substrate.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com