| http://www.w3.org/ns/prov#value | - The present invention has been accomplished in view of such drawbacks and it is a first object of the invention to provide a method of manufacturing a COF package which, when a COF package is to be obtained by the IC chip buried type manufacturing method, permits an IC chip to be buried in such a state as is free from a larger positional deviation than a predetermined limit and which thereby affor
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