| http://www.w3.org/ns/prov#value | - FIELD OF INVENTION [0002] This invention relates to substrates, including but not limited to printed circuit boards, which carry at least one packaged component (such as an integrated circuit chip, or a discrete element such as a resistor, capacitor, inductor, transistor, LED, optical device, MEMS or photocoupler, for example) and in particular to a substrate for receipt of one or more packaged co
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