| http://www.w3.org/ns/prov#value | - The etch-back technique comprises the steps of forming grooves conforming with a pattern of the wiring layer in an insulating film covering a substrate of a semiconductor substrate, depositing a copper film on the insulating film including the trenches, polishing the copper film with a polishing solution, and selectively allowing the copper film to remain within the trenches to form a buried wirin
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