| http://www.w3.org/ns/prov#value | - Generally speaking, however, in the present embodiment, solder bumps 550 are preferably formed from a material that has a low contact resistance, because it is intended to be used with a mating receptacle 560 as shown in FIG. 5C. Accordingly, since this material is not intended to be reflowed, or soldered, it can be formed of any convenient substance, including, for example gold, nickel, or even T
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