About: http://webisa.webdatacommons.org/410384401

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Another embodiment of the present invention is a system for depositing a copper layer onto a transition metal barrier layer or transition metal compound barrier layer for integrated circuit metallization.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com