| http://www.w3.org/ns/prov#value | - SUMMARY OF THE INVENTION [0009] According to its major and broadly stated the present invention is a mounting system for mounting an image sensor chip in a location in a device apart from a PCB board. [0010] In one embodiment of the invention, a multilayered image sensor is back mounted to a plate, and the plate in turn, is installed in a holding pocket of a device.
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