About: http://webisa.webdatacommons.org/51665474

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is a method of fabricating a low cost multi-layer integrated circuit interposer; the interposer made according to that method; and, an integrated circuit chip module, or assembly containing that interposer.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com