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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • cuit structure, and a bonding pad connected to the pad through the opening, a wire bonded to the bonding pad and to a lead of the lead frame, a polymer material, such as epoxy based material, benzocyclobutane (BCB) or polyimide, enclosing the die pad, an inner partition of the lead, the semiconductor chip and the wire.
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