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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • The semiconductor test unit of claim 2, wherein the deformation suppression portion comprises any one of resins including epoxy resins, his-maleimide-triazine resin, PEEK resin, and butadiene resin; polyolefins including polyethylene and polypropylene; polydienes including polybutadiene, polyisoprene, and polyvinylethylene; acrylic resins including polymethylacrylate and polymethyl methacrylate; p
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