The interconnect layer can also comprise a material such as aluminum; an aluminum-silicon binary alloy plug containing less then 2.0 wt % of silicon, as to ensure a silicon-eutectic temperature of more than 567??? C.; an aluminum-copper binary alloy plug containing less than 6.0 wt % of copper to ensure a silicon-eutectic temperature of more than 548??? C.; another binary aluminum alloy plug havin