| http://www.w3.org/ns/prov#value | - ositioned to overlap a corresponding I/O pad on the die; a plurality of solder joint connections that physically and electrically connect I/O pads on the active surface of each die toassociated solder pads on the leads of an associated device area; a plurality of heat sinks, each heat sink including a base, a multiplicity of heat dissipation structures and a partition that extends from a top surfa
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