About: http://webisa.webdatacommons.org/113524528

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The polishing machine of claim 2 wherein said semiconductor wafer has a material including silicon dioxide deposited upon it that must be abraded and polished to control a thickness of said material.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com