| http://www.w3.org/ns/prov#value | - The gap between the chip and the support and the space between the solder joints is usually filled with plastic underfill material 15 in order to mitigate thermomechanical stress and reduce reliability risks on the solder joints. [0035] Support 14 consists of electrically insulating material such as polyimide, but conductive routing strips (not shown in FIG. 1) are integral with support 14.
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