| http://www.w3.org/ns/prov#value | - FIGS. 8 and 9, therefore, illustrate measuring the actual surface area of the bearing surface 44 to predict the polishing rate and other characteristics of the polishing pad 40, as set forth above with respect to FIGS. 3-6. [0035]FIG. 10 is an isometric view of another planarizing machine 200 in accordance with an embodiment of the invention.
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