About: http://webisa.webdatacommons.org/15548749

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention deposits a uniform conductive layer which forms continuous, void-free contacts or vias, including contacts and vias in sub-half micron applications.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com