| http://www.w3.org/ns/prov#value | - the carrier for encapsulating the at least one chip and the at least one passive component, wherein the encapsulant has a side including a portion corresponding to the slanted side of the opening of the carrier and a portion corresponding to a side of the substrate, and the portion of the side of the encapsulant is at least not smaller than the corresponding side of the substrate, and wherein the
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