About: http://webisa.webdatacommons.org/163831397

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 1A is a side view of a portion of a lead frame showing a lead wire bonded between a chip die pad and a lead frame finger according to the prior art.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com