| http://www.w3.org/ns/prov#value | - The force applying mechanism 90W presses against a pressure plate 92W and a compressible member 94W to bias the interconnect 52W against the wafer substrate 10W. By way of example, the compressible member 94W can be formed of an elastomeric material such as silicone, butyl rubber, or fluorosilicone; in foam, gel, solid or molded configurations.
|
