| http://www.w3.org/ns/prov#value | - Optionally, following the removal of the etch stop and the photoresist, the substrate may be exposed to a hydrogen plasma or exposed to a thermal hydrogen treatment, e.g., a flow of hydrogen in the absence of radio frequency power at a temperature above about 250??? C. It is believed that exposing the substrate to hydrogen may reduce any metal oxides, such as copper oxide, that may form on the und
|
