| http://www.w3.org/ns/prov#value | - In one embodiment, barrier layer 112 is a silicon nitride or silicon carbide layer, such as a BloK??? film (barrier low k dielectric) developed by Applied Materials; via dielectric layer 114 is a carbon-doped silica layer, such as a Black Diamond??? film developed by Applied Materials and trench dielectric layer 116 is a mesoporous silica film.
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