| http://www.w3.org/ns/prov#value | - CMP is a preferred planarization process, and apparatus to perform CMP are described in the following U.S. Patents, which are fully incorporated herein by reference for all purposes: U.S. Pat. Nos. 5,486,129; 5,435,772; 5,142,828; 5,036,015 and 3,841,031.
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