| http://www.w3.org/ns/prov#value | - FIG. 7 is a graph showing how the polishing rate of a copper film, a silicon nitride film formed by plasma CVD (P???SiN film), or a SiO2 film formed on a substrate is affected by the concentration of sodium dodecyl sulfate (SDS), which is an anionic surfactant, covering the case where the copper film or the like was subjected to a polishing treatment using a polishing solution containing 0.3% by w
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