| http://www.w3.org/ns/prov#value | - Another preferred embodiment of the present invention is an assembly of a thermal energy generating means, such as an electronic component, a thermal energy dissipating means, such as a heat sink or a heat spreader, and a thermal energy transferring means such as a thermally conductive polymeric material interposed between the generating means and the dissipating means so as to move the thermal en
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