| http://www.w3.org/ns/prov#value | - In view of the above-described problems, the present invention has an object of providing a manufacturing method for manufacturing a compact and reliable resin sealed semiconductor device, by molding a hybrid IC substrate together with a semiconductor chip, such as a power transistor, without casing voids of residual air even when the resin thicknesses above and below a lead frame assembly are dif
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