| http://www.w3.org/ns/prov#value | - In the event that the manner of alignment, superimposition and assembly of base lead frame 110 and first and second offset lead frames 140 and 150, respectively, requires further clarification, FIG. 4 of the drawings is a top elevation of a dual LOC semiconductor die assembly 180 according to the invention after encapsulation but before excess portions of the lead frame strips carrying lead frames
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