| http://www.w3.org/ns/prov#value | - FIG. 1A is a schematic side view of the wafer 110, and FIG. 1B is a schematic side view of the wafer 110 thinned, for example, in accordance with the procedures disclosed in U.S. Pat. No. 6,180,527, assigned to the assignee of the present invention and incorporated herein by reference.
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