About: http://webisa.webdatacommons.org/327258241

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The transmitter ASIC bonding pads 335 are connected to the through-die vias 336, which may be filled with conductive material such as copper or aluminum, via upper traces 337 formed along the upper surface 331.
http://www.w3.org/ns/prov#wasQuotedFrom	google.fr